Microducts bundles - new at SPUR a.s. company
Multiducts bundles are mostly designated for more effective FTTH deployment.
Multi DB bundles of thick walled microducts(optional configurations) have high crush resistence and so can be directly buried into the ground without any protection. Thin jacket allows easy access to individual microducts, followed branching and lead to accessories savings.
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Multi DI bundles of thin walled microducts (optional configurations) with thin jacket (on the base of LDPE) need to have extra protection. Therefore are mostly pulled into pre-installed subducts.
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SPUR a.s.
Specialized plastic products, piping systems, cable protectors, insulating materials made of polyethylene foam, packaging material, bubble wrap,...
KOVOROB, s.r.o. – manufacturer of injection molds for thermoplastics and a reliable partner for plastic processing
14.3.2025 KOVOROB, s.r.o. is an established manufacturer of injection molds for thermoplastics and a specialist in plastic processing. For over 20 years, it has been designing and manufacturing molds for various industrial sectors. In addition to production,...